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Pre-treatment optimization for vacuum plating

2019-03-28 10:35  Times of view:

The pre-treatment of vacuum coating processing is a very important step in electroplating technology. The quality of the substrate material treatment directly affects the quality of the coating, so it should pay due attention to the pre-plating treatment.

Vacuum plating processing

Pre-plating treatment of plated parts is one of the most important factors in determining the quality of plating.In the internship production, the plating failure rate is more than 80% in the pre-treatment process, so the effect of the pre-plating treatment is particularly important. The following is a detailed description of the influence of the appearance of the substrate on the layout and contact force of the coating.


    

First, the influence of the external surface condition on the layout of the coating


The vacuum coating processing layer is composed of crystals or crystal grains, and the size, shape and placement method of the crystal determine the layout characteristics of the plating layer. In various plating solutions, the layout characteristics of the metal plating are also different, mainly due to the different stacking process.

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When the plating is started, the surface of the matrix material is mainly formed with some small dots, that is, the crystal nucleus, which is added at a time, and the number of individual crystals is added, and they are connected to each other to form a plating layer.


    

Second, the impact of the external condition of the base on the contact force


Contact force usually refers to the scale and extent of an object sticking to another object. If a coating falls due to mechanical force or deformation, is blown off by a gas, or is peeled off by corrosion, the coating lacks contact. Contact force is an important performance index of electric accumulation. It has a very direct and important relationship with the appearance of the substrate before electroplating. The quality of the contact directly affects the quality of the coating.

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If there is a lot of oil, rust and other dirt on the surface of the matrix, the plating layer can not be directly related to the appearance of the matrix material, and then the coating gradually peels and falls, which is also the poor connection between the coating and the substrate. the reason. On the contrary, if the surface of the substrate on the electroplating line is excellently cleaned before electroplating, the electroplated layer will directly contact the surface of the substrate and be in good contact with it.


    

Third, the impact of the external condition of the base on the ability to cover up


The appearance of the matrix data is one of the main factors affecting the ability to cover up. Internships indicate that when the metal is stacked on different base materials, the masking of the same plating solution can be different. When chrome plating with chromic acid solution and metal chromium on copper, nickel, brass and steel, the masking of the plating solution can be sequentially reduced. This is because when the metal ions recover on different matrix data, the value of the overpotential is very different. The tapping potential with a small overpotential is relatively positive, and even at a portion where the current density is low, the value of the tapping potential can be reached, so that the masking can be better. The appearance of the matrix data has a more complicated impact on the masking ability.

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In general, the same plating solution can be masked on a surface with a high surface finish to be better than a mask on a rough surface. Because of the large external product, in fact, the current density is low, it is difficult to reach the metal's separation potential, and only a lot of hydrogen is separated. In addition, if the external surface of the substrate is poorly treated before plating, there is no oil film, various phase-forming film layers or dirt, which will not be removed, and the deposition of the plating layer will be hindered, so that the masking can be lowered.

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