Vacuum plating equipment vacuum plating process
Vacuum plating is a new technology that is different from water plating. It is a relatively environmentally friendly plating technology.
The vacuum plating process includes vacuum evaporation, cathode sputtering, ion plating, and the like.
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Vacuum evaporation is a process in which a material is heated under vacuum, and a film-forming material is placed in a vacuum for evaporation or sublimation to deposit one or more layers of a film on the surface of the substrate.
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The principle is that the temperature reaches the evaporation temperature of the coating material, and the generated steam is transferred from the vacuum chamber to the low-temperature part to condense, and no oxidation occurs in the vacuum environment. Note that the material used for vacuum evaporation should be considered. Melting point and boiling point.
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Cathodic iridium plating is also called magnetron sputtering. The process of depositing atoms of a metal target on a substrate by an inert gas plasma generated by glow discharge requires a vacuum of 1.3*10-3Pa. . A quadrature electromagnetic field is formed on the surface of the cathode target, and the adhesion of the ruthenium-plated film layer is stronger than that of vacuum evaporation, which is a high-speed process of vacuum coating technology.
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Ion plating is a method of depositing on the surface of a substrate under the attack of gas ions or substance ions. Ion plating is a new invention of vacuum coating technology. Although the ion plating process is also implemented in a vacuum chamber, the process of coating is through charge transfer. In the form of a strong penetrability, it has a strong adhesion to the substrate to be plated.
Vacuum plating is a physical method. The coating is built under vacuum conditions. The vacuum plating process is already a mature technology. Vacuum coating is basically used for products that need to be coated in various industries.