Renaissance and development of vacuum magnetron sputtering coating for various components of vacuum coating machine
It is not only the most widely used equipment for coating, but also the most widely used equipment in vacuum environment. The vacuum coating machine of different processes works differently, and the process has an impact on the operation mode. The vacuum coating machine has a vacuum system, a cooling system, a detection system, a coating system, and has an evaporation coating, a magnetron sputtering, and an ion plating method.
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The evaporation coating removes the vaporized components and atoms from the film by heating the evaporation source to the surface of the product to be coated and cools to form a film.
The ion plating film utilizes the arc discharge technology to ignite the cathode source under vacuum conditions, and forms an arc discharge between the anode source and the anode source, and forms a film layer on the surface of the product to be coated with the reaction gas under the action of a bias voltage.
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Magnetron sputtering uses glow discharge, which is different from ion plating. Glow discharge generates high-speed ions to bombard the target (the target is also a film to be deposited), and the generated sputter particles adhere to the surface of the product to be coated. Membrane layer.
Vacuum coating machine parts and systems:
Different vacuum degree coating machines use different components. For low vacuum coating machines, vacuum systems only need to be equipped with mechanical pumps to meet the vacuum degree; high vacuum coating machines need to be equipped with booster pumps, Roots pumps, diffusion pumps. Maintain pumps and so on to achieve high vacuum acquisition and stability.
Cooling is a must for all sources. The vacuum coating machine will generate high temperature inside under normal working conditions. The cooling system is responsible for balancing temperature and regulating temperature.
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Renaissance and development of vacuum magnetron sputtering coating
Sputtering is the phenomenon of bombarding a solid (hereinafter referred to as a target) surface with a charge particle (usually a positive ion of an inert gas), thereby causing a phenomenon in which atoms (or molecules) on the surface of the target escape. This phenomenon was discovered by Grove in 1842 when experimentally studying the cathodic corrosion problem and the cathode material was transferred to the vacuum tube wall. The vacuum coating machine used this sputtering method to deposit a film on a substrate was introduced in 1877. However, in the initial stage of depositing a film by this method, there are a series of problems such as a low sputtering rate, a slow film formation rate, and a high pressure and an inert gas to be applied to the apparatus. Therefore, the development is slow and almost eliminated. It is only used in a small amount of chemically active precious metals, difficult metals, media and compounds. Until the 1970s, due to the timely appearance of magnetron sputtering, the sputter coating was rapidly developed and began to enter the path of revival. This is because the magnetron sputtering method can restrain the electrons by the orthogonal electromagnetic field and increase the collision probability between the electrons and the gas molecules, which not only reduces the voltage applied to the cathode, but also increases the sputtering of the positive ions on the target cathode. The rate reduces the probability of electron bombardment of the substrate, thereby lowering its temperature, that is, it has two characteristics of "high speed and low temperature". In the 1980s, although he appeared only for more than a decade, it stood out from the laboratory and really entered the field of industrial production.
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Moreover, with the further development of science and technology, ion beam enhanced sputtering has been introduced in the field of sputter coating in recent years, using a wide beam strong current ion source combined with magnetic field modulation, and combined with conventional two-pole sputtering. A new sputtering mode. Moreover, an intermediate frequency AC power source is introduced into the target of the magnetron sputtering. This medium-frequency AC magnetron sputtering technique, known as twin target sputtering, not only eliminates the "disappearing" effect of the anode. Moreover, the "poisoning" problem of the cathode is also solved, thereby greatly improving the stability of the magnetron sputtering. It provides a solid foundation for the large-scale industrial production of compound film preparation. The revival and development of rapid coating in recent years has been active in the field of vacuum coating technology as an emerging thin film preparation technology.