Optimization of Magnetic Field Distribution of Target Surface in Vacuum Coating Machine

The distribution of the magnetic field on the target surface affects the coating efficiency of the magnetron sputtering vacuum coater. There are already many types of targets that have been developed, such as twin targets, cylindrical targets, and planar targets. The design of these targets can be improved to varying degrees. Coating efficiency.

 For the target distribution in the vacuum coating equipment, once the target design cannot be uniformly distributed due to the magnetic field covering the target surface, the generated plasma is not uniform, thereby affecting the uniformity of film formation and reducing the utilization rate of the target. In order to solve this problem, the researchers tried to place a certain ferromagnet between the target and the magnetic pole, and magnetically change the magnetic field distribution to make the distribution more uniform, and improve the utilization of the target by 6%. This method is called shunting. Design, but at the same time due to the influence of ferromagnet, the magnetic field strength of the target surface is reduced, and the utilization rate of magnetic flux is not so high.

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 There is a circular target design, because the ordinary target shows a similar circular shape after ablation in the coating process, in order to make better use of the target, the target surface is designed to be circular, and the coating of the same amount is compared with the ordinary target. The working voltage, pressure and workpiece temperature required for the circular target are relatively reduced. That is to say, under the same conditions, the output of the circular target is higher, and the lower temperature can increase the range of workpiece selection, such as plastic with a low melting point. Coating is carried out.

There is also a design of full target ablation, which is rectangular, using the same magnetic pole direction and alternating magnetic pole directions, increasing the distance between the magnetic circuits and the thickness of the isolated iron, so that the discharge before each other The effect is greatly reduced, even cut, thereby reducing the operating voltage and reducing the operating pressure by increasing the number of poles.

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By adjusting the magnetic field distribution of the target surface of the magnetron sputtering coating machine, the target material can be more effectively utilized, the working voltage is lowered, and the efficiency of the magnetron sputtering coating is greatly improved.